Microelectronics, MEMS and Nanotechnology

Direct wafer bonding for MEMS and microelectronics

Direct wafer bonding is a method for fabricating advanced substrates for microelectromechanical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer. SOI wafers offer many advantages over conventional silicon wafers. In IC technology, the switching speed of circuits fabricated on SOI is increased by 20-50% co...

Future Trends in Microelectronics Reflections on the Road to Nanotechnology

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Deconstructing energy use in microelectronics manufacturing: an experimental case study of a MEMS fabrication facility.

Semiconductors are quite energy intensive to manufacture on the basis of energy required per mass of material processed. This analysis draws on original data from a case study of the Analog Devices Micromachined Products Division MEMS fabrication facility to examine the consequence of process rate on the energy intensity of semiconductor manufacturing. We trace the impact of process rate on ene...

Microelectronics, radiation, and superconductivity.

Among the costs of technology are health hazards that face employees and consumers. New advances in the highly competitive field of microelectronics involve exposure to a variety of hazards such as gallium arsenide. Small high-technology industries appear unprepared to invest in health and safety. Although stray electromagnetic fields are not a new development, researchers are beginning to asse...

Technical Universitity of Munich JASS 2006 Saint Petersburg MEMS and Nanotechnology